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 It is desired to increases the heat dissipation rate over the surface of an electronic device of spherical shape of 5 mm radius exposed to convection with h=10 W/m2 K by encasing it in a spherical sheet of conductivity 0.04 W/mK. For maximum heat flow, the diameter of the sheet should be                       (IES-96)

(a) 18mm                     (b) 16mm

(c) 12 mm                   (d) 8 mm

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